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Chemical content 74HCT1G86GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT1G86GW-Q100SOT353-1UMT55.67605 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300218125412601235Bangkok, Thailand; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12843
PolymerResin systemProprietary0.0024325.000000.04281
subTotal0.00972100.000000.17124
DieDoped siliconSilicon (Si)7440-21-30.08038100.000001.41621
subTotal0.08038100.000001.41621
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.61049
Iron (Fe)7439-89-60.045512.310000.80174
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02430
Zinc (Zn)7440-66-60.002360.120000.04165
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22560
subTotal1.97000100.0000034.70725
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.11480
Silica fused60676-86-02.3217570.5700040.90438
PigmentCarbon black1333-86-40.006580.200000.11593
PolymerEpoxy resin systemProprietary0.305649.290005.38475
Phenolic resinProprietary0.195435.940003.44299
subTotal3.29000100.0000057.96285
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46100
subTotal0.31000100.000005.46153
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0159499.990000.28086
subTotal0.01594100.000000.28089
total5.67605100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.