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Chemical content 74HCT244BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT244BQ-Q100SOT764-1DHVQFN2028.35195 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298915115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24093
PolymerResin systemProprietary0.0169719.900000.05986
subTotal0.08528100.000000.30079
DieDoped siliconSilicon (Si)7440-21-30.31520100.000001.11175
subTotal0.31520100.000001.11175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.02911
Iron (Fe)7439-89-60.258502.400000.91177
Phosphorus (P)7723-14-00.003230.030000.01140
Zinc (Zn)7440-66-60.010770.100000.03799
subTotal10.77098100.0000037.99027
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68070
FillerSilica -amorphous-7631-86-90.571483.490002.01568
Silica fused60676-86-013.8892184.8200048.98854
PigmentCarbon black1333-86-40.026200.160000.09241
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62376
Epoxy resin systemProprietary0.260361.590000.91832
Phenolic resinProprietary0.368442.250001.29951
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13697
subTotal16.37492100.0000057.75589
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07599
Nickel (Ni)7440-02-00.6628292.300002.33785
Palladium (Pd)7440-05-30.022263.100000.07852
Silver (Ag)7440-22-40.011491.600000.04053
subTotal0.71812100.000002.53289
WirePure metalCopper (Cu)7440-50-80.0844396.550000.29779
Pure metal layerGold (Au)7440-57-50.000310.350000.00108
Palladium (Pd)7440-05-30.002713.100000.00956
subTotal0.08745100.000000.30843
total28.35195100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.