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Chemical content 74HCT259BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT259BQ-Q100SOT763-1DHVQFN1621.81632 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298824115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36598
PolymerResin systemProprietary0.0198419.900000.09092
subTotal0.09968100.000000.45690
DieDoped siliconSilicon (Si)7440-21-30.49157100.000002.25323
subTotal0.49157100.000002.25323
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.55371
Iron (Fe)7439-89-60.196362.400000.90006
Phosphorus (P)7723-14-00.002450.030000.01125
Zinc (Zn)7440-66-60.008180.100000.03750
subTotal8.18167100.0000037.50252
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65912
FillerSilica -amorphous-7631-86-90.434103.490001.98981
Silica fused60676-86-010.5503184.8200048.35972
PigmentCarbon black1333-86-40.019900.160000.09122
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61576
Epoxy resin systemProprietary0.197771.590000.90653
Phenolic resinProprietary0.279872.250001.28283
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10954
subTotal12.43847100.0000057.01453
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07501
Nickel (Ni)7440-02-00.5035192.300002.30793
Palladium (Pd)7440-05-30.016913.100000.07751
Silver (Ag)7440-22-40.008731.600000.04001
subTotal0.54551100.000002.50046
WirePure metalCopper (Cu)7440-50-80.05942100.000000.27236
subTotal0.05942100.000000.27236
total21.81632100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.