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Chemical content 74HCT259BZ

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Type numberPackagePackage descriptionTotal product weight
74HCT259BZSOT8016-1DHXQFN166.62595 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356914061154126030 s123520 s3Bangkok, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17359
ImpurityNon hazardousProprietary0.000010.039500.00011
PolymerResin systemProprietary0.0076639.951410.11559
subTotal0.01917100.000000.28929
DieDoped siliconSilicon (Si)7440-21-30.22121100.000003.33850
subTotal0.22121100.000003.33850
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000045.30985
Nickel (Ni)7440-02-00.092853.000001.40134
subTotal3.09506100.0000046.71119
Mould CompoundAdditiveNon hazardousProprietary0.096472.984001.45588
FillerSilica -amorphous-7631-86-90.112823.490001.70275
Silica fused60676-86-02.7420384.8200041.38315
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.032391.002000.48887
PigmentCarbon black1333-86-40.005300.164000.08001
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.119643.701001.80569
Epoxy resin systemProprietary0.051271.586000.77380
Phenolic resinProprietary0.072832.253001.09922
subTotal3.23276100.0000048.78937
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00244
Nickel (Ni)7440-02-00.0147291.000000.22221
Palladium (Pd)7440-05-30.001298.000000.01954
subTotal0.01618100.000000.24419
WirePure metalCopper (Cu)7440-50-80.0401496.550000.60580
Pure metal layerGold (Au)7440-57-50.000150.350000.00220
Palladium (Pd)7440-05-30.001293.100000.01945
subTotal0.04157100.000000.62745
total6.62595100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.