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Chemical content 74HCT377D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT377D-Q100SOT163-1SO20665.57487 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301661118712601235Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00702
PolymerAcrylic resinProprietary0.0091215.200000.00137
Resin systemProprietary0.004146.900000.00062
subTotal0.06000100.000000.00901
DieDoped siliconSilicon (Si)7440-21-30.76890100.000000.11552
subTotal0.76890100.000000.11552
Lead FrameCopper alloyCopper (Cu)7440-50-8130.8168596.0970019.65472
Iron (Fe)7439-89-63.154132.317000.47390
Lead (Pb)7439-92-10.006130.004500.00092
Phosphorus (P)7723-14-00.110270.081000.01657
Zinc (Zn)7440-66-60.167440.123000.02516
Pure metal layerGold (Au)7440-57-50.037440.027500.00562
Nickel (Ni)7440-02-01.741781.279500.26170
Palladium (Pd)7440-05-30.066700.049000.01002
Silver (Ag)7440-22-40.029270.021500.00440
subTotal136.13000100.0000020.45301
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8130.8632297.4700019.66168
Iron (Fe)7439-89-63.222242.400000.48413
Phosphorus (P)7723-14-00.040280.030000.00605
Zinc (Zn)7440-66-60.134260.100000.02017
subTotal134.26000100.0000020.17203
Mould CompoundAdditiveNon hazardousProprietary18.527874.700002.78374
FillerSilica fused60676-86-0311.4259079.0000046.79051
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-823.652606.000003.55371
PigmentCarbon black1333-86-40.788420.200000.11846
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-615.768404.000002.36914
Non hazardousProprietary16.162614.100002.42837
Tetramethylbiphenyl diglycidyl ether85954-11-67.884202.000001.18457
subTotal394.21000100.0000059.22850
WirePure metalCopper (Cu)7440-50-80.14597100.000000.02193
subTotal0.14597100.000000.02193
total665.57487100.00000100.00000
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