Chemical content 74HCT4017BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4017BQ-Q100SOT763-1DHVQFN1621.74205 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935302479115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36723
PolymerResin systemProprietary0.0198419.900000.09123
DieDoped siliconSilicon (Si)7440-21-30.41905100.000001.92737
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.67857
Iron (Fe)7439-89-60.196362.400000.90314
Phosphorus (P)7723-14-00.002450.030000.01129
Zinc (Zn)7440-66-60.008180.100000.03763
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66479
FillerSilica -amorphous-7631-86-90.434103.490001.99660
Silica fused60676-86-010.5503184.8200048.52491
PigmentCarbon black1333-86-40.019900.160000.09153
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61786
Epoxy resin systemProprietary0.197771.590000.90963
Phenolic resinProprietary0.279872.250001.28721
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11674
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07527
Nickel (Ni)7440-02-00.5035192.300002.31582
Palladium (Pd)7440-05-30.016913.100000.07778
Silver (Ag)7440-22-40.008731.600000.04014
WirePure metalCopper (Cu)7440-50-80.0556896.550000.25609
Pure metal layerGold (Au)7440-57-50.000200.350000.00093
Palladium (Pd)7440-05-30.001793.100000.00822
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.