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Chemical content 74HCT4020BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT4020BQSOT763-1DHVQFN1622.42360 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352907851151012601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.28934
PolymerResin systemProprietary0.0161219.900000.07188
subTotal0.08100100.000000.36122
DieDoped siliconSilicon (Si)7440-21-30.75442100.000003.36440
subTotal0.75442100.000003.36440
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995043.79497
Iron (Fe)7439-89-60.237082.320001.05728
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03646
Zinc (Zn)7440-66-60.012260.120000.05469
Gold alloyGold (Au)7440-57-50.003060.029970.01366
Silver (Ag)7440-22-40.002040.019980.00911
ImpurityNon hazardousProprietary0.000130.001280.00058
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02276
Nickel (Ni)7440-02-00.130671.278720.58274
subTotal10.21900100.0000045.57248
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.46878
FillerSilica -amorphous-7631-86-90.395003.490001.76153
Silica fused60676-86-09.5999384.8200042.81171
PigmentCarbon black1333-86-40.018110.160000.08076
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.54511
Epoxy resin systemProprietary0.179961.590000.80253
Phenolic resinProprietary0.254662.250001.13566
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.86752
subTotal11.31800100.0000050.47360
WirePure metalCopper (Cu)7440-50-80.0494296.550000.22038
Pure metal layerGold (Au)7440-57-50.000180.350000.00080
Palladium (Pd)7440-05-30.001593.100000.00708
subTotal0.05118100.000000.22826
total22.42360100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.