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Chemical content 74HCT4040BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4040BQ-Q100SOT763-1DHVQFN1621.75569 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935303846115712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13789
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09182
subTotal0.05000100.000000.22980
DieDoped siliconSilicon (Si)7440-21-30.75442100.000003.46769
subTotal0.75442100.000003.46769
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.97228
Iron (Fe)7439-89-60.198062.400000.91037
Phosphorus (P)7723-14-00.002480.030000.01138
Zinc (Zn)7440-66-60.008250.100000.03793
subTotal8.25236100.0000037.93196
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66374
FillerSilica -amorphous-7631-86-90.434103.490001.99535
Silica fused60676-86-010.5503084.8200048.49445
PigmentCarbon black1333-86-40.019900.160000.09148
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61747
Epoxy resin systemProprietary0.197771.590000.90906
Phenolic resinProprietary0.279872.250001.28640
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11541
subTotal12.43846100.0000057.17336
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00963
Nickel (Ni)7440-02-00.1906391.000000.87622
Palladium (Pd)7440-05-30.016768.000000.07703
subTotal0.20948100.000000.96288
WirePure metalCopper (Cu)7440-50-80.0492196.550000.22619
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001583.100000.00726
subTotal0.05097100.000000.23427
total21.75569100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.