Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT540PW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93569121111874HCT540PWJ74HCT540PWSOT360-1 (TSSOP20)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 6 ppm; substance 1333-86-4: 1636 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 6 ppm; substance 1333-86-4: 1636 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1378 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.04674077.9000000.075527
AdhesivePolymerAcrylic resin0.00912015.2000000.014737
AdhesivePolymerResin system0.0041406.9000000.006690
Adhesive Total0.060000100.0000000.096954
DieDoped siliconSilicon (Si)7440-21-32.281231100.0000003.686236
Die Total2.281231100.0000003.686236
Lead FrameCopper alloyCopper (Cu)7440-50-836.85816897.56000059.559038
Lead FrameCopper alloyIron (Fe)7439-89-60.8307822.1990001.342459
Lead FrameCopper alloyZinc (Zn)7440-66-60.0374020.0990000.060438
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0147340.0390000.023809
Lead FrameCopper alloyLead (Pb)7439-92-10.0003780.0010000.000611
Base Alloy C19400 Total37.74146499.89800060.986355
Lead FramePure metal layerSilver (Ag)7440-22-40.0385360.1020000.062270
Pre-Plating Total0.0385360.1020000.062270
Lead Frame Total37.780000100.00000061.048625
Mould CompoundFillerSilica fused60676-86-017.21250085.00000027.813644
Mould CompoundPolymerPhenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-01.7212508.5000002.781364
Mould CompoundPolymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.2150006.0000001.963316
Mould CompoundPigmentCarbon black1333-86-40.1012500.5000000.163610
Mould Compound Total20.250000100.00000032.721934
Post-PlatingPure metal layerTin (Sn)7440-31-51.42985799.9900002.310503
Post-PlatingImpurityNon-declarable0.0001430.0100000.000231
Post-Plating Total1.430000100.0000002.310734
WirePure metalCopper (Cu)7440-50-80.083865100.0000000.135517
Wire Total0.083865100.0000000.135517
74HCT540PW Total61.885096100.000000
Notes
Report created on 2025-09-01 09:33:26 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-09-01 09:33:26 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层 (Pre-Plating)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
EFUP Icon 该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-09-01 09:33:26 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.