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Chemical content 74HCT595BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT595BQ-Q100SOT763-1DHVQFN1621.71250 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298876115912601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36773
PolymerResin systemProprietary0.0198419.900000.09136
subTotal0.09968100.000000.45909
DieDoped siliconSilicon (Si)7440-21-30.38940100.000001.79344
subTotal0.38940100.000001.79344
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.72849
Iron (Fe)7439-89-60.196362.400000.90436
Phosphorus (P)7723-14-00.002450.030000.01130
Zinc (Zn)7440-66-60.008180.100000.03768
subTotal8.18167100.0000037.68183
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66706
FillerSilica -amorphous-7631-86-90.434103.490001.99932
Silica fused60676-86-010.5503184.8200048.59095
PigmentCarbon black1333-86-40.019900.160000.09166
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61870
Epoxy resin systemProprietary0.197771.590000.91087
Phenolic resinProprietary0.279872.250001.28896
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11962
subTotal12.43847100.0000057.28714
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07537
Nickel (Ni)7440-02-00.5035192.300002.31897
Palladium (Pd)7440-05-30.016913.100000.07789
Silver (Ag)7440-22-40.008731.600000.04020
subTotal0.54551100.000002.51243
WirePure metalCopper (Cu)7440-50-80.0557796.550000.25686
Pure metal layerGold (Au)7440-57-50.000200.350000.00093
Palladium (Pd)7440-05-30.001793.100000.00825
subTotal0.05776100.000000.26604
total21.71250100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.