Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT595BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT595BQ-Q100SOT763-1DHVQFN1621.71250 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352988761159126030 s123520 s3Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00459
FillerSilver (Ag)7440-22-40.0747675.000000.34432
PolymerAcrylic resinProprietary0.005986.000000.02755
Resin systemProprietary0.0179418.000000.08264
subTotal0.09968100.000000.45910
DieDoped siliconSilicon (Si)7440-21-30.38940100.000001.79344
subTotal0.38940100.000001.79344
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.72849
Iron (Fe)7439-89-60.196362.400000.90436
Phosphorus (P)7723-14-00.002450.030000.01130
Zinc (Zn)7440-66-60.008180.100000.03768
subTotal8.18167100.0000037.68183
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.70945
FillerSilica -amorphous-7631-86-90.434103.490001.99932
Silica fused60676-86-010.5503184.8200048.59095
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57402
PigmentCarbon black1333-86-40.020400.164000.09395
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.12020
Epoxy resin systemProprietary0.197271.586000.90857
Phenolic resinProprietary0.280242.253001.29068
subTotal12.43847100.0000057.28714
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07537
Nickel (Ni)7440-02-00.5035192.300002.31897
Palladium (Pd)7440-05-30.016913.100000.07789
Silver (Ag)7440-22-40.008731.600000.04020
subTotal0.54551100.000002.51243
WirePure metalCopper (Cu)7440-50-80.0557796.550000.25686
Pure metal layerGold (Au)7440-57-50.000200.350000.00093
Palladium (Pd)7440-05-30.001793.100000.00825
subTotal0.05776100.000000.26604
total21.71250100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.