Chemical content 74HCT74BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT74BQ-Q100SOT762-1DHVQFN1418.18780 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298883115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09592
PolymerAcrylic resinProprietary0.001406.000000.00767
Resin systemProprietary0.0041918.000000.02302
DieDoped siliconSilicon (Si)7440-21-30.21261100.000001.16898
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.08370
Iron (Fe)7439-89-60.166072.400000.91311
Phosphorus (P)7723-14-00.002080.030000.01141
Zinc (Zn)7440-66-60.006920.100000.03805
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68317
FillerSilica -amorphous-7631-86-90.367153.490002.01865
Silica fused60676-86-08.9230784.8200049.06076
PigmentCarbon black1333-86-40.016830.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62468
Epoxy resin systemProprietary0.167271.590000.91967
Phenolic resinProprietary0.236702.250001.30142
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14012
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07611
Nickel (Ni)7440-02-00.4258792.300002.34153
Palladium (Pd)7440-05-30.014303.100000.07864
Silver (Ag)7440-22-40.007381.600000.04059
WirePure metalCopper (Cu)7440-50-80.0489996.550000.26933
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001573.100000.00865
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.