×

Chemical content 74HCT74BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT74BQ-Q100SOT762-1DHVQFN1418.18780 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298883115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10244
PolymerResin systemProprietary0.0046319.900000.02545
subTotal0.02326100.000000.12789
DieDoped siliconSilicon (Si)7440-21-30.21261100.000001.16898
subTotal0.21261100.000001.16898
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.08370
Iron (Fe)7439-89-60.166072.400000.91311
Phosphorus (P)7723-14-00.002080.030000.01141
Zinc (Zn)7440-66-60.006920.100000.03805
subTotal6.91978100.0000038.04627
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68317
FillerSilica -amorphous-7631-86-90.367153.490002.01865
Silica fused60676-86-08.9230784.8200049.06076
PigmentCarbon black1333-86-40.016830.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62468
Epoxy resin systemProprietary0.167271.590000.91967
Phenolic resinProprietary0.236702.250001.30142
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14012
subTotal10.52001100.0000057.84102
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07611
Nickel (Ni)7440-02-00.4258792.300002.34153
Palladium (Pd)7440-05-30.014303.100000.07864
Silver (Ag)7440-22-40.007381.600000.04059
subTotal0.46140100.000002.53687
WirePure metalCopper (Cu)7440-50-80.0489996.550000.26933
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001573.100000.00865
subTotal0.05074100.000000.27896
total18.18780100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.