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Chemical content 74HCU04BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCU04BQ-Q100SOT762-1DHVQFN1418.24006 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300228115512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10214
PolymerResin systemProprietary0.0046319.900000.02538
subTotal0.02326100.000000.12752
DieDoped siliconSilicon (Si)7440-21-30.26494100.000001.45254
subTotal0.26494100.000001.45254
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.97745
Iron (Fe)7439-89-60.166072.400000.91049
Phosphorus (P)7723-14-00.002080.030000.01138
Zinc (Zn)7440-66-60.006920.100000.03794
subTotal6.91978100.0000037.93726
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67835
FillerSilica -amorphous-7631-86-90.367153.490002.01287
Silica fused60676-86-08.9230784.8200048.92019
PigmentCarbon black1333-86-40.016830.160000.09228
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62289
Epoxy resin systemProprietary0.167271.590000.91704
Phenolic resinProprietary0.236702.250001.29769
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13399
subTotal10.52001100.0000057.67530
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07589
Nickel (Ni)7440-02-00.4258792.300002.33482
Palladium (Pd)7440-05-30.014303.100000.07842
Silver (Ag)7440-22-40.007381.600000.04047
subTotal0.46140100.000002.52960
WirePure metalCopper (Cu)7440-50-80.0489296.550000.26818
Pure metal layerGold (Au)7440-57-50.000180.350000.00097
Palladium (Pd)7440-05-30.001573.100000.00861
subTotal0.05066100.000000.27776
total18.24006100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.