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Chemical content 74LV138BQ

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Type numberPackagePackage descriptionTotal product weight
74LV138BQSOT763-1DHVQFN1621.78652 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855771151212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13770
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09169
subTotal0.05000100.000000.22948
DieDoped siliconSilicon (Si)7440-21-30.78448100.000003.60074
subTotal0.78448100.000003.60074
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.91996
Iron (Fe)7439-89-60.198062.400000.90908
Phosphorus (P)7723-14-00.002480.030000.01136
Zinc (Zn)7440-66-60.008250.100000.03788
subTotal8.25236100.0000037.87828
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66139
FillerSilica -amorphous-7631-86-90.434103.490001.99253
Silica fused60676-86-010.5503084.8200048.42582
PigmentCarbon black1333-86-40.019900.160000.09135
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61660
Epoxy resin systemProprietary0.197771.590000.90777
Phenolic resinProprietary0.279872.250001.28458
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11242
subTotal12.43846100.0000057.09246
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00962
Nickel (Ni)7440-02-00.1906391.000000.87498
Palladium (Pd)7440-05-30.016768.000000.07692
subTotal0.20948100.000000.96152
WirePure metalCopper (Cu)7440-50-80.0499696.550000.22932
Pure metal layerGold (Au)7440-57-50.000180.350000.00083
Palladium (Pd)7440-05-30.001603.100000.00736
subTotal0.05175100.000000.23751
total21.78652100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.