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Chemical content 74LV1T04GX

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Type numberPackagePackage descriptionTotal product weight
74LV1T04GXSOT1226-3X2SON50.60717 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690196125812601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02706100.000004.45646
subTotal0.02706100.000004.45646
ComponentAdditiveNon hazardousProprietary0.000205.000000.03294
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03294
Silica -amorphous-7631-86-90.0020050.000000.32940
PolymerEpoxy resin systemProprietary0.0012030.000000.19764
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06588
subTotal0.00400100.000000.65880
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.38111
Magnesium (Mg)7439-95-40.000380.150000.06250
Nickel (Ni)7440-02-00.007462.950001.22923
Silicon (Si)7440-21-30.001620.640000.26668
Pure metal layerGold (Au)7440-57-50.000050.020000.00833
Nickel (Ni)7440-02-00.004151.640000.68337
Palladium (Pd)7440-05-30.000230.090000.03750
subTotal0.25300100.0000041.66872
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21068
FillerSilica -amorphous-7631-86-90.000900.290000.14902
Silica fused60676-86-00.2687986.1500044.26899
HardenerPhenolic resinProprietary0.013384.290002.20446
PigmentCarbon black1333-86-40.000590.190000.09763
PolymerEpoxy resin systemProprietary0.027058.670004.45516
subTotal0.31200100.0000051.38594
WireGold alloyGold (Au)7440-57-50.0110099.000001.81229
Palladium (Pd)7440-05-30.000111.000000.01831
subTotal0.01111100.000001.83060
total0.60717100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.