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Chemical content 74LV1T34GX

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Type numberPackagePackage descriptionTotal product weight
74LV1T34GXSOT1226-3X2SON50.61045 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690204125812601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02706100.000004.43252
subTotal0.02706100.000004.43252
ComponentAdditiveNon hazardousProprietary0.000205.000000.03276
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03276
Silica -amorphous-7631-86-90.0020050.000000.32763
PolymerEpoxy resin systemProprietary0.0012030.000000.19658
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06553
subTotal0.00400100.000000.65526
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.16951
Magnesium (Mg)7439-95-40.000380.150000.06217
Nickel (Ni)7440-02-00.007462.950001.22262
Silicon (Si)7440-21-30.001620.640000.26525
Pure metal layerGold (Au)7440-57-50.000050.020000.00829
Nickel (Ni)7440-02-00.004151.640000.67970
Palladium (Pd)7440-05-30.000230.090000.03730
subTotal0.25300100.0000041.44484
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20955
FillerSilica -amorphous-7631-86-90.000900.290000.14822
Silica fused60676-86-00.2687986.1500044.03112
HardenerPhenolic resinProprietary0.013384.290002.19261
PigmentCarbon black1333-86-40.000590.190000.09711
PolymerEpoxy resin systemProprietary0.027058.670004.43122
subTotal0.31200100.0000051.10983
WireGold alloyGold (Au)7440-57-50.0142599.000002.33370
Palladium (Pd)7440-05-30.000141.000000.02357
subTotal0.01439100.000002.35727
total0.61045100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.