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Chemical content 74LVC02ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC02ABQ-Q100SOT762-1DHVQFN1418.11810 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301406115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10283
PolymerResin systemProprietary0.0046319.900000.02555
subTotal0.02326100.000000.12838
DieDoped siliconSilicon (Si)7440-21-30.14043100.000000.77508
subTotal0.14043100.000000.77508
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.22636
Iron (Fe)7439-89-60.166072.400000.91662
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03819
subTotal6.91978100.0000038.19263
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68965
FillerSilica -amorphous-7631-86-90.367153.490002.02642
Silica fused60676-86-08.9230784.8200049.24949
PigmentCarbon black1333-86-40.016830.160000.09290
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62709
Epoxy resin systemProprietary0.167271.590000.92321
Phenolic resinProprietary0.236702.250001.30643
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14835
subTotal10.52001100.0000058.06354
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07640
Nickel (Ni)7440-02-00.4258792.300002.35053
Palladium (Pd)7440-05-30.014303.100000.07895
Silver (Ag)7440-22-40.007381.600000.04075
subTotal0.46140100.000002.54663
WirePure metalCopper (Cu)7440-50-80.0513896.550000.28360
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001653.100000.00911
subTotal0.05322100.000000.29374
total18.11810100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.