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Chemical content 74LVC02ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC02ABQSOT762-1DHVQFN1421.75771 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736851152212601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43441
PolymerResin systemProprietary0.0234819.900000.10792
subTotal0.11800100.000000.54233
DieDoped siliconSilicon (Si)7440-21-30.14043100.000000.64542
subTotal0.14043100.000000.64542
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.72964
Iron (Fe)7439-89-60.205522.346100.94458
Phosphorus (P)7723-14-00.002650.030200.01216
Zinc (Zn)7440-66-60.008890.101500.04087
Pure metal layerGold (Au)7440-57-50.002650.030200.01216
Nickel (Ni)7440-02-00.106921.220500.49139
Palladium (Pd)7440-05-30.004910.056000.02255
Silver (Ag)7440-22-40.001800.020500.00825
subTotal8.76000100.0000040.26160
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69670
FillerSilica -amorphous-7631-86-90.442743.490002.03487
Silica fused60676-86-010.7602784.8200049.45495
PigmentCarbon black1333-86-40.020300.160000.09329
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62970
Epoxy resin systemProprietary0.201711.590000.92706
Phenolic resinProprietary0.285442.250001.31188
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15731
subTotal12.68600100.0000058.30576
WirePure metalCopper (Cu)7440-50-80.0514596.550000.23645
Pure metal layerGold (Au)7440-57-50.000190.350000.00086
Palladium (Pd)7440-05-30.001653.100000.00759
subTotal0.05328100.000000.24490
total21.75771100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.