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Chemical content 74LVC04ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC04ABQ-Q100SOT762-1DHVQFN1418.12982 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299275115712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10277
PolymerResin systemProprietary0.0046319.900000.02553
subTotal0.02326100.000000.12830
DieDoped siliconSilicon (Si)7440-21-30.15224100.000000.83973
subTotal0.15224100.000000.83973
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.20230
Iron (Fe)7439-89-60.166072.400000.91603
Phosphorus (P)7723-14-00.002080.030000.01145
Zinc (Zn)7440-66-60.006920.100000.03817
subTotal6.91978100.0000038.16795
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68856
FillerSilica -amorphous-7631-86-90.367153.490002.02511
Silica fused60676-86-08.9230784.8200049.21766
PigmentCarbon black1333-86-40.016830.160000.09284
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62668
Epoxy resin systemProprietary0.167271.590000.92261
Phenolic resinProprietary0.236702.250001.30559
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14696
subTotal10.52001100.0000058.02601
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07635
Nickel (Ni)7440-02-00.4258792.300002.34902
Palladium (Pd)7440-05-30.014303.100000.07889
Silver (Ag)7440-22-40.007381.600000.04072
subTotal0.46140100.000002.54498
WirePure metalCopper (Cu)7440-50-80.0512996.550000.28291
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001653.100000.00908
subTotal0.05312100.000000.29302
total18.12982100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.