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Chemical content 74LVC08ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC08ABQ-Q100SOT762-1DHVQFN1418.11253 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299053115712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10286
PolymerResin systemProprietary0.0046319.900000.02556
subTotal0.02326100.000000.12842
DieDoped siliconSilicon (Si)7440-21-30.13309100.000000.73479
subTotal0.13309100.000000.73479
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.23781
Iron (Fe)7439-89-60.166072.400000.91691
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03820
subTotal6.91978100.0000038.20438
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69017
FillerSilica -amorphous-7631-86-90.367153.490002.02704
Silica fused60676-86-08.9230784.8200049.26464
PigmentCarbon black1333-86-40.016830.160000.09293
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62728
Epoxy resin systemProprietary0.167271.590000.92349
Phenolic resinProprietary0.236702.250001.30683
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14901
subTotal10.52001100.0000058.08139
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07642
Nickel (Ni)7440-02-00.4258792.300002.35126
Palladium (Pd)7440-05-30.014303.100000.07897
Silver (Ag)7440-22-40.007381.600000.04076
subTotal0.46140100.000002.54741
WirePure metalCopper (Cu)7440-50-80.0530996.550000.29314
Pure metal layerGold (Au)7440-57-50.000190.350000.00106
Palladium (Pd)7440-05-30.001703.100000.00941
subTotal0.05499100.000000.30361
total18.11253100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.