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Chemical content 74LVC138ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC138ABQSOT763-1DHVQFN1621.90574 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352733341151712601235Suzhou, China; Bangkok, Thailand; Hsin-chu, Taiwan; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29618
PolymerResin systemProprietary0.0161219.900000.07358
subTotal0.08100100.000000.36976
DieDoped siliconSilicon (Si)7440-21-30.22312100.000001.01855
subTotal0.22312100.000001.01855
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.83030
Iron (Fe)7439-89-60.237082.320001.08228
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03732
Zinc (Zn)7440-66-60.012260.120000.05598
Gold alloyGold (Au)7440-57-50.003060.029970.01398
Silver (Ag)7440-22-40.002040.019980.00932
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02330
Nickel (Ni)7440-02-00.130671.278720.59652
subTotal10.21900100.0000046.64983
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50350
FillerSilica -amorphous-7631-86-90.395003.490001.80317
Silica fused60676-86-09.5999384.8200043.82380
PigmentCarbon black1333-86-40.018110.160000.08267
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55800
Epoxy resin systemProprietary0.179961.590000.82150
Phenolic resinProprietary0.254662.250001.16250
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91167
subTotal11.31800100.0000051.66681
WirePure metalCopper (Cu)7440-50-80.0623996.550000.28481
Pure metal layerGold (Au)7440-57-50.000230.350000.00103
Palladium (Pd)7440-05-30.002003.100000.00914
subTotal0.06462100.000000.29498
total21.90574100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.