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Chemical content 74LVC139BQ

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Type numberPackagePackage descriptionTotal product weight
74LVC139BQSOT763-1DHVQFN1621.86523 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352738871151712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29673
PolymerResin systemProprietary0.0161219.900000.07372
subTotal0.08100100.000000.37045
DieDoped siliconSilicon (Si)7440-21-30.18284100.000000.83619
subTotal0.18284100.000000.83619
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.91335
Iron (Fe)7439-89-60.237082.320001.08428
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03739
Zinc (Zn)7440-66-60.012260.120000.05608
Gold alloyGold (Au)7440-57-50.003060.029970.01401
Silver (Ag)7440-22-40.002040.019980.00934
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02334
Nickel (Ni)7440-02-00.130671.278720.59763
subTotal10.21900100.0000046.73625
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50629
FillerSilica -amorphous-7631-86-90.395003.490001.80651
Silica fused60676-86-09.5999384.8200043.90499
PigmentCarbon black1333-86-40.018110.160000.08282
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55904
Epoxy resin systemProprietary0.179961.590000.82302
Phenolic resinProprietary0.254662.250001.16466
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91521
subTotal11.31800100.0000051.76254
WirePure metalCopper (Cu)7440-50-80.0621796.550000.28435
Pure metal layerGold (Au)7440-57-50.000230.350000.00103
Palladium (Pd)7440-05-30.002003.100000.00913
subTotal0.06439100.000000.29451
total21.86523100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.