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Chemical content 74LVC1G08GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G08GXSOT1226-3X2SON50.60386 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298378125812601235Bangkok, Thailand; Hsin-chu, Taiwan; Shanghai, China; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000003.39713
subTotal0.02051100.000003.39713
ComponentAdditiveNon hazardousProprietary0.000205.000000.03312
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03312
Silica -amorphous-7631-86-90.0020050.000000.33120
PolymerEpoxy resin systemProprietary0.0012030.000000.19872
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06624
subTotal0.00400100.000000.66240
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.59698
Magnesium (Mg)7439-95-40.000380.150000.06285
Nickel (Ni)7440-02-00.007462.950001.23597
Silicon (Si)7440-21-30.001620.640000.26814
Pure metal layerGold (Au)7440-57-50.000050.020000.00838
Nickel (Ni)7440-02-00.004151.640000.68711
Palladium (Pd)7440-05-30.000230.090000.03771
subTotal0.25300100.0000041.89714
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21184
FillerSilica -amorphous-7631-86-90.000900.290000.14984
Silica fused60676-86-00.2687986.1500044.51164
HardenerPhenolic resinProprietary0.013384.290002.21654
PigmentCarbon black1333-86-40.000590.190000.09817
PolymerEpoxy resin systemProprietary0.027058.670004.47958
subTotal0.31200100.0000051.66761
WireGold alloyGold (Au)7440-57-50.0142099.000002.35180
Palladium (Pd)7440-05-30.000141.000000.02376
subTotal0.01435100.000002.37556
total0.60386100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.