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Chemical content 74LVC1G10GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G10GW-Q100SOT363-2SC-885.72239 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935309202125812601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12857
PolymerResin systemProprietary0.0024525.000000.04286
subTotal0.00981100.000000.17143
DieDoped siliconSilicon (Si)7440-21-30.07260100.000001.26875
subTotal0.07260100.000001.26875
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.70753
Iron (Fe)7439-89-60.048742.310000.85176
Lead (Pb)7439-92-10.000210.010000.00369
Phosphorus (P)7723-14-00.001480.070000.02581
Zinc (Zn)7440-66-60.002530.120000.04425
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23967
subTotal2.11000100.0000036.87271
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.68210
Silica fused60676-86-02.2159070.5700038.72330
PigmentCarbon black1333-86-40.006280.200000.10974
PolymerEpoxy resin systemProprietary0.291719.290005.09763
Phenolic resinProprietary0.186525.940003.25941
subTotal3.14000100.0000054.87218
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.46518
subTotal0.37000100.000006.46581
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0199899.990000.34908
subTotal0.01998100.000000.34911
total5.72239100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.