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Chemical content 74LVC1G11GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G11GXSOT1255-2X2SON60.73674 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307081147612601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02723100.000003.69548
subTotal0.02723100.000003.69548
ComponentAdditiveNon hazardousProprietary0.000255.000000.03393
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03393
Silica -amorphous-7631-86-90.0025050.000000.33933
PolymerEpoxy resin systemProprietary0.0015030.000000.20360
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06787
subTotal0.00500100.000000.67866
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100037.20159
Magnesium (Mg)7439-95-40.000440.150000.05904
Nickel (Ni)7440-02-00.008562.950001.16120
Silicon (Si)7440-21-30.001860.640000.25192
Pure metal layerGold (Au)7440-57-50.000060.020000.00787
Nickel (Ni)7440-02-00.004761.640000.64555
Palladium (Pd)7440-05-30.000260.090000.03543
subTotal0.29000100.0000039.36260
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.22149
FillerSilica -amorphous-7631-86-90.001150.290000.15666
Silica fused60676-86-00.3428886.1500046.53976
HardenerPhenolic resinProprietary0.017074.290002.31753
PigmentCarbon black1333-86-40.000760.190000.10264
PolymerEpoxy resin systemProprietary0.034518.670004.68369
subTotal0.39800100.0000054.02177
WireGold alloyGold (Au)7440-57-50.0163599.000002.21922
Palladium (Pd)7440-05-30.000171.000000.02242
subTotal0.01652100.000002.24164
total0.73674100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.