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Chemical content 74LVC1G126GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G126GSSOT1202X2SON60.95613 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292902132612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02481100.000002.59531
subTotal0.02481100.000002.59531
ComponentAdditiveNon hazardousProprietary0.000255.000000.02615
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02615
Silica -amorphous-7631-86-90.0025050.000000.26147
PolymerEpoxy resin systemProprietary0.0015030.000000.15688
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05229
subTotal0.00500100.000000.52294
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.61433
Magnesium (Mg)7439-95-40.000630.150000.06605
Nickel (Ni)7440-02-00.012422.950001.29893
Silicon (Si)7440-21-30.002690.640000.28180
Pure metal layerGold (Au)7440-57-50.000080.020000.00881
Nickel (Ni)7440-02-00.006901.640000.72212
Palladium (Pd)7440-05-30.000380.090000.03963
subTotal0.42100100.0000044.03167
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.21055
FillerSilica -amorphous-7631-86-90.001420.290000.14892
Silica fused60676-86-00.4230086.1500044.24048
HardenerPhenolic resinProprietary0.021064.290002.20304
PigmentCarbon black1333-86-40.000930.190000.09757
PolymerEpoxy resin systemProprietary0.042578.670004.45229
subTotal0.49100100.0000051.35285
WireGold alloyGold (Au)7440-57-50.0141799.000001.48221
Palladium (Pd)7440-05-30.000141.000000.01497
subTotal0.01432100.000001.49718
total0.95613100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.