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Chemical content 74LVC1G126GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G126GXSOT1226-3X2SON50.60702 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298387125812601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02481100.000004.08792
subTotal0.02481100.000004.08792
ComponentAdditiveNon hazardousProprietary0.000205.000000.03295
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03295
Silica -amorphous-7631-86-90.0020050.000000.32948
PolymerEpoxy resin systemProprietary0.0012030.000000.19769
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06590
subTotal0.00400100.000000.65897
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.39084
Magnesium (Mg)7439-95-40.000380.150000.06252
Nickel (Ni)7440-02-00.007462.950001.22953
Silicon (Si)7440-21-30.001620.640000.26675
Pure metal layerGold (Au)7440-57-50.000050.020000.00834
Nickel (Ni)7440-02-00.004151.640000.68354
Palladium (Pd)7440-05-30.000230.090000.03751
subTotal0.25300100.0000041.67903
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21073
FillerSilica -amorphous-7631-86-90.000900.290000.14906
Silica fused60676-86-00.2687986.1500044.27992
HardenerPhenolic resinProprietary0.013384.290002.20500
PigmentCarbon black1333-86-40.000590.190000.09766
PolymerEpoxy resin systemProprietary0.027058.670004.45626
subTotal0.31200100.0000051.39863
WireGold alloyGold (Au)7440-57-50.0130799.000002.15363
Palladium (Pd)7440-05-30.000131.000000.02175
subTotal0.01320100.000002.17538
total0.60702100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.