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Chemical content 74LVC1G157GV

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Type numberPackagePackage descriptionTotal product weight
74LVC1G157GVSOT457SC-7410.64315 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352783131251512601235Nijmegen, Netherlands; Seremban, Malaysia; Hefei, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14094
PolymerResin systemProprietary0.0050025.000000.04698
subTotal0.02000100.000000.18792
DieDoped siliconSilicon (Si)7440-21-30.09134100.000000.85817
subTotal0.09134100.000000.85817
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.46765
Iron (Fe)7439-89-60.074182.150000.69693
Phosphorus (P)7723-14-00.000520.015200.00493
Zinc (Zn)7440-66-60.002000.058000.01880
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22691
subTotal3.45000100.0000032.41522
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.49464
PigmentCarbon black1333-86-40.019560.300000.18378
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.06823
Phenolic resinProprietary0.586809.000005.51341
subTotal6.52000100.0000061.26006
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.88528
subTotal0.52000100.000004.88577
WireGold alloyGold (Au)7440-57-50.0414099.000000.38895
Palladium (Pd)7440-05-30.000421.000000.00393
subTotal0.04182100.000000.39288
total10.64315100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.