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Chemical content 74LVC1G16GM

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Type numberPackagePackage descriptionTotal product weight
74LVC1G16GMSOT886XSON61.91001 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307588125512601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05125100.000002.68299
subTotal0.05125100.000002.68299
ComponentAdditiveNon hazardousProprietary0.000255.000000.01309
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01309
Silica -amorphous-7631-86-90.0025050.000000.13089
PolymerEpoxy resin systemProprietary0.0015030.000000.07853
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02618
subTotal0.00500100.000000.26178
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.19965
Magnesium (Mg)7439-95-40.001160.150000.06063
Nickel (Ni)7440-02-00.022772.950001.19235
Silicon (Si)7440-21-30.004940.640000.25868
Pure metal layerGold (Au)7440-57-50.000150.020000.00808
Nickel (Ni)7440-02-00.012661.640000.66287
Palladium (Pd)7440-05-30.000690.090000.03638
subTotal0.77200100.0000040.41864
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22883
FillerSilica -amorphous-7631-86-90.003090.290000.16185
Silica fused60676-86-00.9183686.1500048.08137
HardenerPhenolic resinProprietary0.045734.290002.39430
PigmentCarbon black1333-86-40.002030.190000.10604
PolymerEpoxy resin systemProprietary0.092428.670004.83883
subTotal1.06600100.0000055.81122
WireGold alloyGold (Au)7440-57-50.0156099.000000.81688
Palladium (Pd)7440-05-30.000161.000000.00825
subTotal0.01576100.000000.82513
total1.91001100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.