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Chemical content 74LVC1G175GM

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Type numberPackagePackage descriptionTotal product weight
74LVC1G175GMSOT886XSON61.95872 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352772081321612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
9352772081151612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.08956100.000004.57234
subTotal0.08956100.000004.57234
ComponentAdditiveNon hazardousProprietary0.000255.000000.01276
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01276
Silica -amorphous-7631-86-90.0025050.000000.12763
PolymerEpoxy resin systemProprietary0.0015030.000000.07658
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02553
subTotal0.00500100.000000.25526
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.24969
Magnesium (Mg)7439-95-40.001160.150000.05912
Nickel (Ni)7440-02-00.022772.950001.16270
Silicon (Si)7440-21-30.004940.640000.25225
Pure metal layerGold (Au)7440-57-50.000150.020000.00788
Nickel (Ni)7440-02-00.012661.640000.64638
Palladium (Pd)7440-05-30.000690.090000.03547
subTotal0.77200100.0000039.41349
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22314
FillerSilica -amorphous-7631-86-90.003090.290000.15783
Silica fused60676-86-00.9183686.1500046.88567
HardenerPhenolic resinProprietary0.045734.290002.33476
PigmentCarbon black1333-86-40.002030.190000.10340
PolymerEpoxy resin systemProprietary0.092428.670004.71850
subTotal1.06600100.0000054.42330
WireGold alloyGold (Au)7440-57-50.0259099.000001.32221
Palladium (Pd)7440-05-30.000261.000000.01336
subTotal0.02616100.000001.33557
total1.95872100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.