Chemical content 74LVC1G19GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G19GW-Q100SOT363-2SC-885.72858 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935307307125912601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12843
PolymerResin systemProprietary0.0024525.000000.04281
DieDoped siliconSilicon (Si)7440-21-30.07833100.000001.36743
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.66894
Iron (Fe)7439-89-60.048742.310000.85084
Lead (Pb)7439-92-10.000210.010000.00368
Phosphorus (P)7723-14-00.001480.070000.02578
Zinc (Zn)7440-66-60.002530.120000.04420
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23941
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.67380
Silica fused60676-86-02.2159070.5700038.68145
PigmentCarbon black1333-86-40.006280.200000.10963
PolymerEpoxy resin systemProprietary0.291719.290005.09212
Phenolic resinProprietary0.186525.940003.25589
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.45820
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0204399.990000.35663
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.