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Chemical content 74LVC1G27GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G27GSSOT1202X2SON60.96185 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935297284132612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02723100.000002.83059
subTotal0.02723100.000002.83059
ComponentAdditiveNon hazardousProprietary0.000255.000000.02599
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02599
Silica -amorphous-7631-86-90.0025050.000000.25992
PolymerEpoxy resin systemProprietary0.0015030.000000.15595
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05198
subTotal0.00500100.000000.51983
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.36686
Magnesium (Mg)7439-95-40.000630.150000.06565
Nickel (Ni)7440-02-00.012422.950001.29121
Silicon (Si)7440-21-30.002690.640000.28013
Pure metal layerGold (Au)7440-57-50.000080.020000.00875
Nickel (Ni)7440-02-00.006901.640000.71783
Palladium (Pd)7440-05-30.000380.090000.03939
subTotal0.42100100.0000043.76982
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20929
FillerSilica -amorphous-7631-86-90.001420.290000.14804
Silica fused60676-86-00.4230086.1500043.97739
HardenerPhenolic resinProprietary0.021064.290002.18994
PigmentCarbon black1333-86-40.000930.190000.09699
PolymerEpoxy resin systemProprietary0.042578.670004.42581
subTotal0.49100100.0000051.04746
WireGold alloyGold (Au)7440-57-50.0174499.000001.81357
Palladium (Pd)7440-05-30.000181.000000.01832
subTotal0.01762100.000001.83189
total0.96185100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.