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Chemical content 74LVC1G3157GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G3157GXSOT1255-2X2SON60.75817 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308636147812601235Hsin-chu, Taiwan; Shanghai, China; Hefei, China; Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04806100.000006.33845
subTotal0.04806100.000006.33845
ComponentAdditiveNon hazardousProprietary0.000255.000000.03297
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03297
Silica -amorphous-7631-86-90.0025050.000000.32974
PolymerEpoxy resin systemProprietary0.0015030.000000.19784
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06595
subTotal0.00500100.000000.65947
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.15007
Magnesium (Mg)7439-95-40.000440.150000.05737
Nickel (Ni)7440-02-00.008562.950001.12837
Silicon (Si)7440-21-30.001860.640000.24480
Pure metal layerGold (Au)7440-57-50.000060.020000.00765
Nickel (Ni)7440-02-00.004761.640000.62730
Palladium (Pd)7440-05-30.000260.090000.03442
subTotal0.29000100.0000038.24998
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21523
FillerSilica -amorphous-7631-86-90.001150.290000.15223
Silica fused60676-86-00.3428886.1500045.22429
HardenerPhenolic resinProprietary0.017074.290002.25203
PigmentCarbon black1333-86-40.000760.190000.09974
PolymerEpoxy resin systemProprietary0.034518.670004.55130
subTotal0.39800100.0000052.49482
WireGold alloyGold (Au)7440-57-50.0169499.000002.23418
Palladium (Pd)7440-05-30.000171.000000.02257
subTotal0.01711100.000002.25675
total0.75817100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.