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Chemical content 74LVC1G332GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G332GW-Q100SOT363-2SC-885.55241 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304346125712601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.13251
PolymerResin systemProprietary0.0024525.000000.04417
subTotal0.00981100.000000.17668
DieDoped siliconSilicon (Si)7440-21-30.07260100.000001.30759
subTotal0.07260100.000001.30759
Lead FrameCopper alloyCopper (Cu)7440-50-82.0113395.3237036.22445
Iron (Fe)7439-89-60.044272.098000.79727
Lead (Pb)7439-92-10.000010.000300.00011
Phosphorus (P)7723-14-00.000780.037100.01410
Zinc (Zn)7440-66-60.002550.121000.04598
Pure metal layerSilver (Ag)7440-22-40.051062.419900.91960
subTotal2.11000100.0000038.00151
Mould CompoundAdditiveNon hazardousProprietary0.086132.900001.55122
Triphenylphosphine603-35-00.001480.050000.02675
FillerSilica -amorphous-7631-86-92.1384072.0000038.51301
PigmentCarbon black1333-86-40.001480.050000.02675
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4455015.000008.02354
Phenol Formaldehyde resin (generic)9003-35-40.2970010.000005.34903
subTotal2.97000100.0000053.49030
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00033
Tin solderTin (Sn)7440-31-50.3699699.990006.66311
subTotal0.37000100.000006.66378
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0200099.990000.36018
subTotal0.02000100.000000.36022
total5.55241100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.