×

Chemical content 74LVC1G53GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G53GTSOT833-1XSON82.50688 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352803121151812601235Ayutthaya, Thailand; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10157100.000004.05179
subTotal0.10157100.000004.05179
ComponentAdditiveNon hazardousProprietary0.000755.000000.02992
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02992
Silica -amorphous-7631-86-90.0075050.000000.29918
PolymerEpoxy resin systemProprietary0.0045030.000000.17951
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05984
subTotal0.01500100.000000.59837
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.24971
Magnesium (Mg)7439-95-40.001530.145700.06120
Nickel (Ni)7440-02-00.030682.914001.22401
Silicon (Si)7440-21-30.006650.631400.26522
Pure metal layerGold (Au)7440-57-50.000370.035000.01470
Nickel (Ni)7440-02-00.028562.712001.13916
Palladium (Pd)7440-05-30.001260.120000.05041
subTotal1.05300100.0000042.00441
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21294
FillerSilica -amorphous-7631-86-90.003780.290000.15062
Silica fused60676-86-01.1216786.1500044.74379
HardenerPhenolic resinProprietary0.055864.290002.22810
PigmentCarbon black1333-86-40.002470.190000.09868
PolymerEpoxy resin systemProprietary0.112888.670004.50294
subTotal1.30200100.0000051.93707
WireGold alloyGold (Au)7440-57-50.0349599.000001.39424
Palladium (Pd)7440-05-30.000351.000000.01408
subTotal0.03530100.000001.40832
total2.50688100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.