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Chemical content 74LVC1G58GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G58GW-Q100SOT363-2SC-885.73919 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304437125612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12820
PolymerResin systemProprietary0.0024525.000000.04273
subTotal0.00981100.000000.17093
DieDoped siliconSilicon (Si)7440-21-30.08947100.000001.55897
subTotal0.08947100.000001.55897
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.60300
Iron (Fe)7439-89-60.048742.310000.84927
Lead (Pb)7439-92-10.000210.010000.00368
Phosphorus (P)7723-14-00.001480.070000.02574
Zinc (Zn)7440-66-60.002530.120000.04412
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23897
subTotal2.11000100.0000036.76478
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.65962
Silica fused60676-86-02.2159070.5700038.60994
PigmentCarbon black1333-86-40.006280.200000.10942
PolymerEpoxy resin systemProprietary0.291719.290005.08270
Phenolic resinProprietary0.186525.940003.24987
subTotal3.14000100.0000054.71155
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.44626
subTotal0.37000100.000006.44689
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0199199.990000.34684
subTotal0.01991100.000000.34687
total5.73919100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.