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Chemical content 74LVC1G80GM

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Type numberPackagePackage descriptionTotal product weight
74LVC1G80GMSOT886XSON61.92488 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352772011321612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
9352772011151712601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06089100.000003.16340
subTotal0.06089100.000003.16340
ComponentAdditiveNon hazardousProprietary0.000255.000000.01299
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01299
Silica -amorphous-7631-86-90.0025050.000000.12988
PolymerEpoxy resin systemProprietary0.0015030.000000.07793
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02598
subTotal0.00500100.000000.25977
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.90456
Magnesium (Mg)7439-95-40.001160.150000.06016
Nickel (Ni)7440-02-00.022772.950001.18314
Silicon (Si)7440-21-30.004940.640000.25668
Pure metal layerGold (Au)7440-57-50.000150.020000.00802
Nickel (Ni)7440-02-00.012661.640000.65774
Palladium (Pd)7440-05-30.000690.090000.03610
subTotal0.77200100.0000040.10640
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22706
FillerSilica -amorphous-7631-86-90.003090.290000.16060
Silica fused60676-86-00.9183686.1500047.70994
HardenerPhenolic resinProprietary0.045734.290002.37581
PigmentCarbon black1333-86-40.002030.190000.10522
PolymerEpoxy resin systemProprietary0.092428.670004.80145
subTotal1.06600100.0000055.38008
WireGold alloyGold (Au)7440-57-50.0207899.000001.07955
Palladium (Pd)7440-05-30.000211.000000.01090
subTotal0.02099100.000001.09045
total1.92488100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.