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Chemical content 74LVC1G80GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G80GW-Q100SOT353-1UMT55.67343 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299033125612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12849
PolymerResin systemProprietary0.0024325.000000.04283
subTotal0.00972100.000000.17132
DieDoped siliconSilicon (Si)7440-21-30.08119100.000001.43104
subTotal0.08119100.000001.43104
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.62601
Iron (Fe)7439-89-60.045512.310000.80211
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02431
Zinc (Zn)7440-66-60.002360.120000.04167
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22570
subTotal1.97000100.0000034.72327
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.11855
Silica fused60676-86-02.3217570.5700040.92327
PigmentCarbon black1333-86-40.006580.200000.11598
PolymerEpoxy resin systemProprietary0.305649.290005.38723
Phenolic resinProprietary0.195435.940003.44458
subTotal3.29000100.0000057.98961
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46352
subTotal0.31000100.000005.46405
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0125299.990000.22068
subTotal0.01252100.000000.22070
total5.67343100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.