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Chemical content 74LVC1G99GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G99GSSOT1203X2SON81.33316 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292796115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04339100.000003.25503
subTotal0.04339100.000003.25503
ComponentAdditiveNon hazardousProprietary0.000305.000000.02250
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02250
Silica -amorphous-7631-86-90.0030050.000000.22503
PolymerEpoxy resin systemProprietary0.0018030.000000.13502
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04501
subTotal0.00600100.000000.45006
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.83363
Magnesium (Mg)7439-95-40.000860.150000.06481
Nickel (Ni)7440-02-00.016992.950001.27457
Silicon (Si)7440-21-30.003690.640000.27652
Pure metal layerGold (Au)7440-57-50.000120.020000.00864
Nickel (Ni)7440-02-00.009451.640000.70857
Palladium (Pd)7440-05-30.000520.090000.03889
subTotal0.57600100.0000043.20563
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.21005
FillerSilica -amorphous-7631-86-90.001980.290000.14857
Silica fused60676-86-00.5884086.1500044.13608
HardenerPhenolic resinProprietary0.029304.290002.19784
PigmentCarbon black1333-86-40.001300.190000.09734
PolymerEpoxy resin systemProprietary0.059228.670004.44178
subTotal0.68300100.0000051.23166
WireGold alloyGold (Au)7440-57-50.0245299.000001.83941
Palladium (Pd)7440-05-30.000251.000000.01858
subTotal0.02477100.000001.85799
total1.33316100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.