×

Chemical content 74LVC1G99GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G99GTSOT833-1XSON82.49283 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352844371151612601235Nijmegen, Netherlands; Seremban, Malaysia; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08679100.000003.48157
subTotal0.08679100.000003.48157
ComponentAdditiveNon hazardousProprietary0.000755.000000.03009
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03009
Silica -amorphous-7631-86-90.0075050.000000.30086
PolymerEpoxy resin systemProprietary0.0045030.000000.18052
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06017
subTotal0.01500100.000000.60173
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.47093
Magnesium (Mg)7439-95-40.001530.145700.06155
Nickel (Ni)7440-02-00.030682.914001.23091
Silicon (Si)7440-21-30.006650.631400.26671
Pure metal layerGold (Au)7440-57-50.000370.035000.01478
Nickel (Ni)7440-02-00.028562.712001.14558
Palladium (Pd)7440-05-30.001260.120000.05069
subTotal1.05300100.0000042.24115
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21414
FillerSilica -amorphous-7631-86-90.003780.290000.15147
Silica fused60676-86-01.1216786.1500044.99597
HardenerPhenolic resinProprietary0.055864.290002.24066
PigmentCarbon black1333-86-40.002470.190000.09924
PolymerEpoxy resin systemProprietary0.112888.670004.52832
subTotal1.30200100.0000052.22980
WireGold alloyGold (Au)7440-57-50.0356899.000001.43129
Palladium (Pd)7440-05-30.000361.000000.01446
subTotal0.03604100.000001.44575
total2.49283100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.