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Chemical content 74LVC1GX04GV

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Type numberPackagePackage descriptionTotal product weight
74LVC1GX04GVSOT457SC-7410.66592 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352740251251712601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14063
PolymerResin systemProprietary0.0050025.000000.04688
subTotal0.02000100.000000.18751
DieDoped siliconSilicon (Si)7440-21-30.12074100.000001.13200
subTotal0.12074100.000001.13200
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.40048
Iron (Fe)7439-89-60.074182.150000.69544
Phosphorus (P)7723-14-00.000520.015200.00492
Zinc (Zn)7440-66-60.002000.058000.01876
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22642
subTotal3.45000100.0000032.34602
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.40179
PigmentCarbon black1333-86-40.019560.300000.18339
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.04247
Phenolic resinProprietary0.586809.000005.50164
subTotal6.52000100.0000061.12929
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.87485
subTotal0.52000100.000004.87534
WireGold alloyGold (Au)7440-57-50.0348399.000000.32658
Palladium (Pd)7440-05-30.000351.000000.00330
subTotal0.03518100.000000.32988
total10.66592100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.