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Chemical content 74LVC1GX04GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1GX04GW-Q100SOT363-2SC-885.76660 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301454125712601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12759
PolymerResin systemProprietary0.0024525.000000.04253
subTotal0.00981100.000000.17012
DieDoped siliconSilicon (Si)7440-21-30.12074100.000002.09376
subTotal0.12074100.000002.09376
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.43377
Iron (Fe)7439-89-60.048742.310000.84523
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02561
Zinc (Zn)7440-66-60.002530.120000.04391
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23784
subTotal2.11000100.0000036.59002
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.62321
Silica fused60676-86-02.2159070.5700038.42642
PigmentCarbon black1333-86-40.006280.200000.10890
PolymerEpoxy resin systemProprietary0.291719.290005.05854
Phenolic resinProprietary0.186525.940003.23442
subTotal3.14000100.0000054.45149
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.41562
subTotal0.37000100.000006.41625
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0160599.990000.27829
subTotal0.01605100.000000.27832
total5.76660100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.