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Chemical content 74LVC1T45GM-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1T45GM-Q100SOT886XSON61.95223 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690846115512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.08458100.000004.33243
subTotal0.08458100.000004.33243
ComponentAdditiveNon hazardousProprietary0.000255.000000.01281
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01281
Silica -amorphous-7631-86-90.0025050.000000.12806
PolymerEpoxy resin systemProprietary0.0015030.000000.07684
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02561
subTotal0.00500100.000000.25613
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.37353
Magnesium (Mg)7439-95-40.001160.150000.05932
Nickel (Ni)7440-02-00.022772.950001.16656
Silicon (Si)7440-21-30.004940.640000.25308
Pure metal layerGold (Au)7440-57-50.000150.020000.00791
Nickel (Ni)7440-02-00.012661.640000.64853
Palladium (Pd)7440-05-30.000690.090000.03559
subTotal0.77200100.0000039.54452
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22388
FillerSilica -amorphous-7631-86-90.003090.290000.15835
Silica fused60676-86-00.9183686.1500047.04154
HardenerPhenolic resinProprietary0.045734.290002.34252
PigmentCarbon black1333-86-40.002030.190000.10375
PolymerEpoxy resin systemProprietary0.092428.670004.73419
subTotal1.06600100.0000054.60423
WireGold alloyGold (Au)7440-57-50.0244099.000001.25003
Palladium (Pd)7440-05-30.000251.000000.01263
subTotal0.02465100.000001.26266
total1.95223100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.