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Chemical content 74LVC1T45GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1T45GSSOT1202X2SON60.97699 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292925132612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04229100.000004.32855
subTotal0.04229100.000004.32855
ComponentAdditiveNon hazardousProprietary0.000255.000000.02559
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02559
Silica -amorphous-7631-86-90.0025050.000000.25589
PolymerEpoxy resin systemProprietary0.0015030.000000.15353
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05118
subTotal0.00500100.000000.51178
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.72581
Magnesium (Mg)7439-95-40.000630.150000.06464
Nickel (Ni)7440-02-00.012422.950001.27120
Silicon (Si)7440-21-30.002690.640000.27579
Pure metal layerGold (Au)7440-57-50.000080.020000.00862
Nickel (Ni)7440-02-00.006901.640000.70670
Palladium (Pd)7440-05-30.000380.090000.03878
subTotal0.42100100.0000043.09154
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20605
FillerSilica -amorphous-7631-86-90.001420.290000.14574
Silica fused60676-86-00.4230086.1500043.29589
HardenerPhenolic resinProprietary0.021064.290002.15600
PigmentCarbon black1333-86-40.000930.190000.09549
PolymerEpoxy resin systemProprietary0.042578.670004.35723
subTotal0.49100100.0000050.25640
WireGold alloyGold (Au)7440-57-50.0175399.000001.79408
Palladium (Pd)7440-05-30.000181.000000.01812
subTotal0.01770100.000001.81220
total0.97699100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.