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Chemical content 74LVC257ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC257ABQSOT763-1DHVQFN1621.95723 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352751741151812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29549
PolymerResin systemProprietary0.0161219.900000.07341
subTotal0.08100100.000000.36890
DieDoped siliconSilicon (Si)7440-21-30.27853100.000001.26850
subTotal0.27853100.000001.26850
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.72517
Iron (Fe)7439-89-60.237082.320001.07974
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03723
Zinc (Zn)7440-66-60.012260.120000.05585
Gold alloyGold (Au)7440-57-50.003060.029970.01395
Silver (Ag)7440-22-40.002040.019980.00930
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02325
Nickel (Ni)7440-02-00.130671.278720.59512
subTotal10.21900100.0000046.54044
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49998
FillerSilica -amorphous-7631-86-90.395003.490001.79894
Silica fused60676-86-09.5999384.8200043.72103
PigmentCarbon black1333-86-40.018110.160000.08247
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55669
Epoxy resin systemProprietary0.179961.590000.81958
Phenolic resinProprietary0.254662.250001.15978
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90719
subTotal11.31800100.0000051.54566
WirePure metalCopper (Cu)7440-50-80.0586196.550000.26693
Pure metal layerGold (Au)7440-57-50.000210.350000.00097
Palladium (Pd)7440-05-30.001883.100000.00857
subTotal0.06070100.000000.27647
total21.95723100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.