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Chemical content 74LVC2G00GN

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Type numberPackagePackage descriptionTotal product weight
74LVC2G00GNSOT1116X2SON81.18310 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292236115612601235Ayutthaya, Thailand; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05546100.000004.68759
subTotal0.05546100.000004.68759
ComponentAdditiveNon hazardousProprietary0.000705.000000.05917
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05917
Silica -amorphous-7631-86-90.0070050.000000.59167
PolymerEpoxy resin systemProprietary0.0042030.000000.35500
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11833
subTotal0.01400100.000001.18334
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033039.96939
Magnesium (Mg)7439-95-40.000740.144900.06234
Nickel (Ni)7440-02-00.014752.897201.24645
Silicon (Si)7440-21-30.003190.627700.27005
MetallisationGold (Au)7440-57-50.000210.042100.01811
Nickel (Ni)7440-02-00.016503.241801.39471
Palladium (Pd)7440-05-30.000730.143000.06152
subTotal0.50900100.0000043.02257
Mould CompoundAdditiveNon hazardousProprietary0.002380.410000.20134
FillerSilica -amorphous-7631-86-90.001680.290000.14241
Silica fused60676-86-00.5005386.1500042.30678
HardenerPhenolic resinProprietary0.024924.290002.10674
PigmentCarbon black1333-86-40.001100.190000.09331
PolymerEpoxy resin systemProprietary0.050378.670004.25769
subTotal0.58100100.0000049.10827
WireGold alloyGold (Au)7440-57-50.0234199.000001.97858
Palladium (Pd)7440-05-30.000241.000000.01999
subTotal0.02364100.000001.99857
total1.18310100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.