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Chemical content 74LVC2G00GS

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Type numberPackagePackage descriptionTotal product weight
74LVC2G00GSSOT1203X2SON81.34521 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292381115612601235Ayutthaya, Thailand; Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05546100.000004.12269
subTotal0.05546100.000004.12269
ComponentAdditiveNon hazardousProprietary0.000305.000000.02230
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02230
Silica -amorphous-7631-86-90.0030050.000000.22301
PolymerEpoxy resin systemProprietary0.0018030.000000.13381
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04460
subTotal0.00600100.000000.44602
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.46785
Magnesium (Mg)7439-95-40.000860.150000.06423
Nickel (Ni)7440-02-00.016992.950001.26315
Silicon (Si)7440-21-30.003690.640000.27404
Pure metal layerGold (Au)7440-57-50.000120.020000.00856
Nickel (Ni)7440-02-00.009451.640000.70222
Palladium (Pd)7440-05-30.000520.090000.03854
subTotal0.57600100.0000042.81859
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20817
FillerSilica -amorphous-7631-86-90.001980.290000.14724
Silica fused60676-86-00.5884086.1500043.74072
HardenerPhenolic resinProprietary0.029304.290002.17815
PigmentCarbon black1333-86-40.001300.190000.09647
PolymerEpoxy resin systemProprietary0.059228.670004.40200
subTotal0.68300100.0000050.77275
WireGold alloyGold (Au)7440-57-50.0245199.000001.82183
Palladium (Pd)7440-05-30.000251.000000.01840
subTotal0.02476100.000001.84023
total1.34521100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.