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Chemical content 74LVC2G04GS-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC2G04GS-Q100SOT1202X2SON60.97951 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356906761251412601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04528100.000004.62242
subTotal0.04528100.000004.62242
ComponentAdditiveNon hazardousProprietary0.000255.000000.02552
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02552
Silica -amorphous-7631-86-90.0025050.000000.25523
PolymerEpoxy resin systemProprietary0.0015030.000000.15314
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05105
subTotal0.00500100.000000.51046
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.62104
Magnesium (Mg)7439-95-40.000630.150000.06447
Nickel (Ni)7440-02-00.012422.950001.26793
Silicon (Si)7440-21-30.002690.640000.27508
Pure metal layerGold (Au)7440-57-50.000080.020000.00860
Nickel (Ni)7440-02-00.006901.640000.70488
Palladium (Pd)7440-05-30.000380.090000.03868
subTotal0.42100100.0000042.98068
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20552
FillerSilica -amorphous-7631-86-90.001420.290000.14537
Silica fused60676-86-00.4230086.1500043.18450
HardenerPhenolic resinProprietary0.021064.290002.15045
PigmentCarbon black1333-86-40.000930.190000.09524
PolymerEpoxy resin systemProprietary0.042578.670004.34602
subTotal0.49100100.0000050.12710
WireGold alloyGold (Au)7440-57-50.0170699.000001.74145
Palladium (Pd)7440-05-30.000171.000000.01759
subTotal0.01723100.000001.75904
total0.97951100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.