×

Chemical content 74LVC2G241GS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G241GSSOT1203X2SON81.33436 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292798115512601235Suzhou, China; Seremban, Malaysia; Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04478100.000003.35589
subTotal0.04478100.000003.35589
ComponentAdditiveNon hazardousProprietary0.000305.000000.02248
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02248
Silica -amorphous-7631-86-90.0030050.000000.22483
PolymerEpoxy resin systemProprietary0.0018030.000000.13490
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04497
subTotal0.00600100.000000.44966
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.79691
Magnesium (Mg)7439-95-40.000860.150000.06475
Nickel (Ni)7440-02-00.016992.950001.27342
Silicon (Si)7440-21-30.003690.640000.27627
Pure metal layerGold (Au)7440-57-50.000120.020000.00863
Nickel (Ni)7440-02-00.009451.640000.70793
Palladium (Pd)7440-05-30.000520.090000.03885
subTotal0.57600100.0000043.16676
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20986
FillerSilica -amorphous-7631-86-90.001980.290000.14844
Silica fused60676-86-00.5884086.1500044.09638
HardenerPhenolic resinProprietary0.029304.290002.19586
PigmentCarbon black1333-86-40.001300.190000.09725
PolymerEpoxy resin systemProprietary0.059228.670004.43779
subTotal0.68300100.0000051.18558
WireGold alloyGold (Au)7440-57-50.0243499.000001.82403
Palladium (Pd)7440-05-30.000251.000000.01842
subTotal0.02458100.000001.84245
total1.33436100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.