×

Chemical content 74LVC2G241GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G241GTSOT833-1XSON82.49438 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352789261152012601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand; Suzhou, China; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08956100.000003.59045
subTotal0.08956100.000003.59045
ComponentAdditiveNon hazardousProprietary0.000755.000000.03007
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03007
Silica -amorphous-7631-86-90.0075050.000000.30068
PolymerEpoxy resin systemProprietary0.0045030.000000.18041
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06014
subTotal0.01500100.000000.60137
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.44640
Magnesium (Mg)7439-95-40.001530.145700.06151
Nickel (Ni)7440-02-00.030682.914001.23014
Silicon (Si)7440-21-30.006650.631400.26654
Pure metal layerGold (Au)7440-57-50.000370.035000.01478
Nickel (Ni)7440-02-00.028562.712001.14487
Palladium (Pd)7440-05-30.001260.120000.05066
subTotal1.05300100.0000042.21490
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21401
FillerSilica -amorphous-7631-86-90.003780.290000.15137
Silica fused60676-86-01.1216786.1500044.96801
HardenerPhenolic resinProprietary0.055864.290002.23927
PigmentCarbon black1333-86-40.002470.190000.09917
PolymerEpoxy resin systemProprietary0.112888.670004.52551
subTotal1.30200100.0000052.19734
WireGold alloyGold (Au)7440-57-50.0344899.000001.38218
Palladium (Pd)7440-05-30.000351.000000.01396
subTotal0.03482100.000001.39614
total2.49438100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.