×

Chemical content 74LVC2G38GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G38GTSOT833-1XSON82.51553 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352789231152012601235Ayutthaya, Thailand; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.11092100.000004.40932
subTotal0.11092100.000004.40932
ComponentAdditiveNon hazardousProprietary0.000755.000000.02981
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02981
Silica -amorphous-7631-86-90.0075050.000000.29815
PolymerEpoxy resin systemProprietary0.0045030.000000.17889
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05963
subTotal0.01500100.000000.59629
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.11475
Magnesium (Mg)7439-95-40.001530.145700.06099
Nickel (Ni)7440-02-00.030682.914001.21980
Silicon (Si)7440-21-30.006650.631400.26430
Pure metal layerGold (Au)7440-57-50.000370.035000.01465
Nickel (Ni)7440-02-00.028562.712001.13524
Palladium (Pd)7440-05-30.001260.120000.05023
subTotal1.05300100.0000041.85996
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21221
FillerSilica -amorphous-7631-86-90.003780.290000.15010
Silica fused60676-86-01.1216786.1500044.58993
HardenerPhenolic resinProprietary0.055864.290002.22044
PigmentCarbon black1333-86-40.002470.190000.09834
PolymerEpoxy resin systemProprietary0.112888.670004.48746
subTotal1.30200100.0000051.75848
WireGold alloyGold (Au)7440-57-50.0342699.000001.36209
Palladium (Pd)7440-05-30.000351.000000.01376
subTotal0.03461100.000001.37585
total2.51553100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.